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Home / Products/Semiconductors/packaging paste for semiconductor

Electronic Components
Photovoltaics Packaging
Semiconductors
packaging paste for semiconductor
Specialty Pastes

Die Attach Paste

HS-411 silver paste is designed for chip (such as LED/IC) packaging.

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Product details

HS-411 silver paste is designed for chip (such as LED/IC) packaging

It has high thermal conductivity, high electrical conductivity and high reliability. Excellent rheological properties make it suitable for high speed dispensing.

HS-412 silver paste is designed for chip (such as high power LED) packaging

It has high thermal conductivity, high electrical conductivity and high reliability. In addition, high-temperature adhesion of the paste is excellent. This paste suits dispensing process.