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Home / Products/Semiconductors/packaging paste for semiconductor

Electronic Components
Photovoltaics Packaging
Semiconductors
packaging paste for semiconductor
Specialty Pastes

Die Attach Paste

HS-411 silver paste is designed for chip (such as LED/IC) packaging.

Learn more+
Nano-Sintered Materials

HS-401 is a nano sintered silver paste. It can be used for high power modules (such as IGBT) packaging. It has high thermal conductivity, high electrical conductivity and high reliability.

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Address:No.13, Riyue North Second Road, Qidingshan Street, Jinzhou District, Dalian City, Liaoning Province, China

Email Address:hs-tech@huashengchn.com

Contact person:Mr Ji

Phone:+86-411-39554099

Links: 中國半導(dǎo)體協(xié)會中國電子元件行業(yè)協(xié)會佳利電子廣東風(fēng)華高新科技華信安電子科技三環(huán)集團江蘇燦勤科技

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